《微电子技术专业英语》(王波、谈向萍主编)内容分为6个单元。第1单元为微电子技术介绍。第2单元为半导体器件，主要内容包括双极型器件、MOS器件、微波与光电子器件。第3单元为半导体工艺，主要内容包括晶体生长、薄膜生长、光刻、腐蚀、扩散、注入等基本半导体工艺，双极型集成电路工艺，MOS集成电路工艺。第4单元为集成电路设计，主要内容包括设计方法、设计工具、综合与仿真。第5单元为MEMS，主要内容包括MEMS概念与特点，MEMS工艺、器件与材料等。第6单元为科技文献范例，主要介绍实际微电子设备的操作方法。 

本书由无锡职业技术学院王波、谈向萍任主编，平毅、吴孔培也参与了编写。

《微电子技术专业英语》(王波、谈向萍主编)涉及半导体器件、半导体工艺、集成电路、微型机电系统(MEMS)等微电子技术的基础知识，旨在逐步提高学生的阅读、理解和翻译微电子技术专业书刊资料的能力，为学生今后能够以英语为工具，获取和交流专业技术信息打下较好的基础。

《微电子技术专业英语》注重选用不同类型的各种资料，有教材、科普资料、设备说明书等，并附上了很多插图，力求达到较好的教学效果。

本书适合作为本科院校、函授学院、高等职业院校的微电子技术专业教材，也可作为其他电类专业学生的参考用书。

Unit 1 A Brief Introduce to Microelectronic Technology

1.1 History About Microelectronics

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1.2 Introduction To Some Courses 

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1.3 Reading Materials

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Unit 2 Semiconductor Device

2.1 Semiconductor Diode

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2.2 Transistors

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2.3 Microwave and Photonic devices

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Unit 3 Micro-electronic Technology

3.1 Crystal Growth

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3.2 Film Growth

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3.3 Photolithography

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3.4 Oxide Growth

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3.5 Diffusion and Ion Implantation

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3.6 Etching

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Unit 4 Integrated Circuits

4.1 Introduction of Integrated Circuits

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4.2 Integrated circuit design and verification

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4.3 Introduction of Cadence Tools

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Unit 5 Microelectronic Mechanical Systems (MEMS)

5.1 Introduction to MEMS

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5.2 Materials for MEMS

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5.3 Processes for Micromachining

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Unit 6 Scientific and Technological Papers

6.1 Film Thickness Tester

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6.2 WL13A0G10 Test System Option Manual

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Appendix Technical Vocabulary

Reference