Cezhou Zhao、Zhou Fang、Qifeng Lu所著的《AN INTRODUCTION OF MICROELECTRONICS》内容包括：半导体材料、半导体器件、微电子工艺及制造、以及IC设计等的基础和基本知识。

本书力图以比较浅显易懂的方式来介绍半导体物理和器件的基础知识，介绍了微电子制造的基本工艺知识和半导体器件，如IC电阻、二极管、MOSFETs和双极晶体管的工艺流程，也介绍了简单MOS数字集成电路和模拟集成电路的概论、电路分析和版图设计。

Preface

Chapter 1 Introduction

 1.1 History of semiconductor devices and ICs

 1.2 Moore's Law--transistor scaling

 1.3 Die yield and die cost

 References

Chapter 2 Semiconductor material fundamentals

 2.1 Atomic structures

2.1.1 Elements and element periodic table

2.1.2 Bohr's theory--orbits

2.1.3 Distribution of electrons--valence electrons

2.1.4 Chemical bonds

 2.2 Crystal structures

2.2.1 General material structures

2.2.2 Crystallography--diamond structure and zinc blende structure

2.2.3 Crystallographic notation

2.2.4 Bohr's theory--energy level and energy band

 2.3 Energy band theory

2.3.1 Insulator, semiconductor and conductor

2.3.2 Electrons and holes

2.3.3 Generation and recombination

 2.4 Doping of semiconductors

2.4.1 Doping elements

2.4.2 Doping: n-type

2.4.3 Doping: p-type

2.4.4 Counter doping

 2.5 Carriers distribution

2.5.1 Fermi function and Fermi level

2.5.2 Density of states

2.5.3 Electron and hole concentrations

 2.6 Carrier drift and diffusion

2.6.1 Carrier scattering

2.6.2 Carrier drift--drift currents and mobility

2.6.3 Electric field and energy band bending

2.6.4 Carrier diffusion--diffusion currents and Einstein relation

 References

Chapter 3 Semiconductor device fundamentals

 3.1 PN junction

3.1.1 Formation of depletion region

3.1.2 Built-in potential

3.1.3 Distribution of electric field and electric potential

3.1.4 Effect of applied voltage

3.1.5 Depletion capacitance

 3.2 Metal-semiconductor contacts and MOS capacitors

3.2.1 Schottky diode and Ohmic contact

3.2.2 MOS capacitance and measurement

3.2.3 MOS energy band diagram

3.2.4 Capacitance--voltage characteristics

 3.3 MOSFETs

3.3.1 Current--voltage characteristics

3.3.2 Types and circuit symbols of MOSFETs

3.3.3 Switch model of MOSFETs

 3.4 Bipolar junction transistors

3.4.1 PN junction--a brief review

3.4.2 BJT structure and circuit symbols

3.4.3 NPN BJT operation--a qualitative analysis

3.4.4 NPN BJT operation--a quantitative analysis

 References

Chapter 4 Semiconductor fabrication fundamentals

 4.1 IC fabrication techniques

4.1.1 Thin film formation

4.1.2 Photolithography and etching

4.1.3 Doping

 4.2 IC resistor and diode process

4.2.1 IC resistor--masks and process steps

4.2.2 Design rules

4.2.3 Sheet resistance

4.2.4 Layout design of an IC resistor

4.2.5 Diode--masks and process steps

 4.3 MOSFET process

4.3.1 NMOSFET process flow and layout

4.3.2 Local oxidation of silicon

4.3.3 CMOS n well process flow

 4.4 BJT process

4.4.1 BJT process steps

4.4.2 Layout of an NPN BJT IC

 References

Chapter 5 Integrated circuits--concepts and design

 5.1 NMOS digital circuits

5.1.1 NMOS digital circuits analysis--logic and calculation

5.1.2 MOSIS design rules for NMOS ICs

5.1.3 Layouts of NMOS logic families

 5.2 CMOS digital circuits

5.2.1 CMOS digital circuits analysis

5.2.2 MOSIS design rules for CMOS ICs

5.2.3 MOS transistors in series/parallel connection

5.2.4 CMOS inverter, NOR gates and NAND gates

5.2.5 Ratioed logic and combinational equivalent circuit

5.2.6 Dynamic circuits

 5.3 MOS analog circuits

5.3.1 MOSFET active resistors and potential dividers

5.3.2 MOSFET common-source stages

5.3.3 CMOS push-pull amplifiers

5.3.4 MOSFET current mirrors

5.3.5 MOSFET differential amplifiers

 References

Appendix I Properties of semiconductor materials

Appendix II Symbols and constant

Appendix III L-Edit Quick Guide